Description
The industry standard program for quality assurance/visual acceptance of electronic assemblies based on the world's most widely used electronics assembly acceptability standard. Prerequisite: ELEC1011 Electronics Assembly and Soldering.
Objectives:
• Purpose and application of IPC-A-610
• Hardware installation
• Soldering criteria, including lead free connections
• Soldered requirements for connecting to terminals
• Soldered connection requirements for plated-through holes
• Surface mounting criteria for chip components, leadless and leaded chip carriers
• Swaged hardware, and heatsink requirements of mechanical assemblies
• Component mounting criteria for DIPS, socket pins, and card edge connectors
• Jumper wire assembly requirements
• Solder fillet dimensional criteria for all major SMT component groups
• Soldering, such as tombstoning, dewetting, voiding, etc
• Criteria for component damage, laminate conditions, cleaning and coating